Introduction

   DR-QG8G diamond laser cutting machine is specially designed  equipment for the diamond-cutting,  fast cutting speed, high production efficiency, low loss, its simple operation of software is efficient and time-saving . The automatic DR-QG8G ultraviolet laser diamond laser cutting machine use  ultraviolet laser machine with high-power 355nm as a light source, ultraviolet beam focused spot is extremely small, it can achieve ultra-fine cutting. ultraviolet laser processing is a "cold processing", "cold" cutting leads to few place that heat affect, and  there is no stress in the grain with the processing of non-contact manner so the production yield of crystal grain cutted is high,the parameters  of electrical performance is much better than mechanical cutting .  As High-precision, automated system configuration , it is better than mechanical cutting methods at the cutting speed, material utilization,  cost and so on. ultraviolet laser machine with High Power 355nm ; high precision two-dimensional platform; high-precision rotating platform; automatic delivery and discharge device; high precision CCD imaging control system; gas cooling system is more convenient  than  water cooling method of the mechanical cutting ,and it also makes the useage cost lown

 Device characteristics

Good quality of Laser beam, small focus spot, narrow cutting gap,  high processing speed,  smal heat affected zone ; cutting gap is  flat smooth, no cracks, high yield; high productivity, close cutting gap, high utilization of silicon area. Automatic delivery discharge, automatic image processing, without manual operation.High cutting speed, high efficiency and precision. Non-contact processing, without supplies, low cost of usage and  maintenance costs. The whole process is controlled by computer software, it is easy to operate,and it can give the feedback of abnormal signal . The performance of machine is stable,and it can be used for a long time.

materials applicated and industrial applications

Mainly used for scribing and cutting of diamond, sapphire; it also applies to the scribing and fine processing of thin ceramics, silicon wafers, IC die, the polymer films and other materials.

Specifications

 

Laser wavelength 532 nm

 

Beam divergence angle ≤ 2.0mrad

 

Cutting width 10-30μm

 

Cutting depth of 10-40μm

 

Cutting width precision of ± 2μm

 

Cutting accuracy ± 2μm

 

Cutting a straight line accuracy of ± 5μm

 

Cutting straight-line speed 0-300 mm / s

 

Range of processing 300mm × 300mm

 

Rated input voltage single-phase AC 220V ± 10%, 50 Hz/60Hz, with protection of ground (such as voltage fluctuation is too large to be equipped with voltage regulator)

 

Maximum input power 2 kW

 

Size 1300 mm x 710 mm x 1400 mm

 

Cooling oil-cooling