Product Main

Specifications

It's gap filled with high-performance thermal conductivity material, mainly used in electronic device and heat sinks or product transfer interface between the enclosure. It has a good adhesive flexible, good compression performance and excellent thermal conductivity. Easy off, easy to operate.
It's widely use for the communications equipment, computer, swithing power suppply, DVD and etc.
The basic specification is: 200mm*400mm thickness is 0.5mm-15mm. (for each dimension need to add 0.5mm, such as 0.5; 1; 1.5; 2^. Up to 15mm).
WE COULD DO IT ANY DIMENSION TAHT WHAT YOU NEED. If you have any questions pls don't hesitate to contact to us.