1. Sample' s free
2. 6 years experienced manufacture
3. Min sacing/width : 0.1/0.1mm
4. Rohs, ISO9001, QS9000
| Place Of Origin: | GuangDong China(Mainland) | ||||
| Numbers Of layers: | single-sided, Double-sided, multilayer | ||||
| Board Thickness: | 0.1mm-3.0mm | ||||
| Base Meterial: | FR-4, CEM-1, CEM-3, FR-1, Rogers, Teflon, Aluminium Base, Ceramic | ||||
| Min. Line Spacing width: | 0.1mm | ||||
| Min. Line Width: | 0.1mm | ||||
| Min. Hole Size: | 0.1mm | ||||
|
Min trace to pad/pad to pad space |
0.15mm | ||||
| Min drill diameter: | 0.2mm | ||||
| Min via pad: | 0.6mm | ||||
| Min board size: | 560mm*500mm | ||||
| Copper Thickness: | H/H-3/3OZ | ||||
| Au plating thickness: | Min. 0.05um Max. 1.5um | ||||
| Soldermask ink: | Blue, Red, Green, Black, White, Yellow | ||||
| Soldermask bridge ability: | 0.1mm | ||||
| Soldermask rigidity: | 6H | ||||
| Silkscree: | White | ||||
| V-grooving tolerance: | Remain thickness: : +/-0.1mm | ||||
| Electrial testing: | Max Test Voltage: 250V | ||||
| Surface Finishing: | Immersion Gold, Gold plating, HASL, Lead free HALL, OSP, | ||||
| ISO9001/UL/Rohs certified | |||||
| Quality report: | Solderability test and Final inspection | ||||
| Packaging& Delivery: | |||||
| Packaging Detail: Vacuum package | |||||
| Delivery Detail: 7 work days | |||||