T870A soldering bga chips Reballing Stationion
1.Work floor size:360X240mm
2. power:1000W
3.preheating size:240*180mm

 

Features
*Adopt infrared weld technology which independent exploration.
*Use infrared heat, easy to cut through, heat proportion piercing tradition weld machine with sirocco.
*Easily operate. Just need one day training. Can operation this machine.
*Don't need weld tools. This machine can weld all the component of 35x35-50x50mm.
*This machine has 800W heating system. Widely to240x180mm.
*Infrared heating don't have sirocco flow. Don't impact perimeter small component. Can suitable for all of the component, especially Micro BGA component.
*Definitely can satisfy the computer, the notebook, the electricity swims and so on the BGA sealing off/repairs to request; Specially especially suits to the computer north and south bridge.

Technic parameter
1.Work floor size: 360X240mm
2.Rated voltage and frequency: AC220-230v 60/50Hz
3.Complete machine power: 1000W
4.Infra-red lamp body power: 150W
5.Preheating chassis power: 800W
6.Infra-red lamp body heating size: Φ70mm(50x50mm)
7.Preheating chassis preheating size: 240x180mm
8.Infra-red lamp body temperature adjustable: 20'C-35'C
9.Preheating chassis temperature adjustable: 6'C-20'C

Instrument inventory
*Welding table main body: 1
*Infra-red lamp body: 1
*Temperature sensor: 1
*Board support of the circuit: 1
*Power line: 1
*User's manual(Compact disc): 1