*work floor size:120X120mm
*power:800W
*preheating:15x15-35x35mm
*size: 26*33.5*45.5cm
*Usage: 4 in 1 almighty station
*power:800W
*preheating:15x15-35x35mm
*size: 26*33.5*45.5cm
*Usage: 4 in 1 almighty station
T862D+ BGA Rework Station
Infrared BGA Rework Station
IR Heating BGA Rework Station
High power Rework
IR Heating BGA Rework Station
High power Rework
Convenient for use
Introduction:
1. High performance,large-scale outp ut in a short period of time Heat welding 45×45mm down below the temperature of electronic comp onents A diustable high and low in a row,canbe welded directly dow large raers of IC.
2. Infraed heating without hot air flow will not little impact on the surrounding components,this will prevent the operat or Heating,applicable to all components. Use of zero-contro l technology,so thatthe infrared Heat la mps filc ker-free,and thus more suitable Maintenance workers,but also to extend the use of the light bulb Life.
3. Perme adility strong,uniform heating,heat Set alamp post and the role of the infrard en ergy at the same time,ensuring uniform he ating to av oid a circuitbo ar and Deformation components,Plastic components for the closure of the circuit bo ar boards are unique and convenient.
4. Hot air gun adjustable air volume32,to adapt diffe rent work;Silicone handle follow-up,
2. Infraed heating without hot air flow will not little impact on the surrounding components,this will prevent the operat or Heating,applicable to all components. Use of zero-contro l technology,so thatthe infrared Heat la mps filc ker-free,and thus more suitable Maintenance workers,but also to extend the use of the light bulb Life.
3. Perme adility strong,uniform heating,heat Set alamp post and the role of the infrard en ergy at the same time,ensuring uniform he ating to av oid a circuitbo ar and Deformation components,Plastic components for the closure of the circuit bo ar boards are unique and convenient.
4. Hot air gun adjustable air volume32,to adapt diffe rent work;Silicone handle follow-up,
feel bette l ron using high-power heating elements,the rapid warming.
5. Oniy fan in the infrared,orheaat setto work open and delay the work,quietenergy.
6. Taiwan-controlled warm-up adhoc,first of warm-up poweras awhole Board,and then heating IC(for plastic closures IC).
7. PCB stent to open special groove,to facilitate the release foder circuit board.
8. Quartz galss lens,no dan ger of bursting.
5. Oniy fan in the infrared,orheaat setto work open and delay the work,quietenergy.
6. Taiwan-controlled warm-up adhoc,first of warm-up poweras awhole Board,and then heating IC(for plastic closures IC).
7. PCB stent to open special groove,to facilitate the release foder circuit board.
8. Quartz galss lens,no dan ger of bursting.