Model Features
New generation of laser scribing machine DR-HP50 has passed CE certification, mainly used for scribing and cutting of solar cells, ceramic substrate ,thin metal films and a variety of silicon in the electronics industry, semiconductor industry and solar industry .The device is designed by experts, its prominent features are: high beam quality and stable power, precision CNC table and automatic cooling unit. Some of the most important parts are producted in the United Kingdom, the United States and in Germany. It results in higher production efficiency as the whole control system, easy operation and low maintenance,
This machine uses Nd: YAG laser (laser wavelength: 1064nm, laser power: 50W), Cruciform working table, duplex vacuum suction cups and the control software that the company developed . The Performance and price ratio is high. At this time,it is the most popular and most practical models in the market of solar wafer scribing.
materials applicated and industrial applications
1) Scribing of silicon, polycrystalline silicon solar films and silicon cell in the solar industry;
2) It also can cut a variety of fragile items, but also can cut a number of flexible sheets of metal and non-metallic slice .
Application:
The scribing of monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cell , cutting of ceramic, diamond , scribing of silicon, germanium, gallium arsenide and semiconductor substrates, semiconductor devices and integrated circuits alumina ceramic substrate (such as ceramic substrates);precision cutting, drilling of thin metal template,cutting of the template of SMT placement machine ; Use: used in crossed and cutting of solar cells, ceramic substrate,thin metal sheets and the various wafers in electronic industry, semiconductor industry and solar industry,, , etc..
Equipment features
excellent beam quality and reliable system
Up to 120 mm / s in the scribing speed, low defect rate
automatic cooling unit
precision CNC working table
friendly interface and simple operation of software Specifications
Laser working material: Nd3 +: YAG
Laser wavelength: 1064 nm
Pump Light: krypton lamp
Cavity: Ceramic Cavity
Modulation frequency :0.5-50 kHz
Average laser power: adjustable, maximum 50 W
Collimated light: red laser
Dicing speed: adjustable, maximum 120mm / s
Dicing depth: maximum 1.2mm
Dicing line width: minimum 0.02 mm
Bench Repeat positioning accuracy: 0.01mm
Table travel: 300 mm × 300 mm
Rated input voltage: three-phase four-wire AC 380V ± 10%, 50 Hz / 60 Hz, with a protected ground (such as voltage fluctuation is too large to be equipped with voltage regulator)
Maximum input power: 5 kW
Size: 550 mm × 290 mm × 650 mm
Net Weight: about 560 kg
Cooling method: Water-cooled
Standard
Laser 1 Tai
Centrifugal fan 1 Tai
Vacuum pump station 1
Cooling unit (cooler, temperature controller, water tank, filter) 1 set
Bench unit (CNC) 1 set
Krypton lamp 2
Laser conversion film a Tai
Computer, a Tai
Scribing a set of software
Operation Manual 1