NC - 3000 series biphenyl structured epoxy resin
This kind of epoxy resin is through phenolic type epoxy resin with biphenyl compounds, through condensation structure and the generated high heat resistant epoxy resin. Its molecular structure as illustrated
NC - 3000 series of biphenyl type epoxy resin products, including three varieties: standard (NC - 3000 - H), low melt viscosity type (NC - 3000), high softening point type (NC - 3000 - H), low melt viscosity model (CER - 3000 - L). They constitute condensate’s main performance table 7 shown.
|
|
experimental condition
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Unit
|
NC-3000
|
NC-3000-H
|
CER-3000-L
|
|
Glass Transition Temperature
|
DMA
TMA
HDT
|
℃
|
167
139
134
|
175
145
144
|
161
136
125
|
|
Flexural Strength
|
30℃
120℃
|
MPa
|
90
60
|
110
65
|
100
50
|
|
Mofulus of elasticity
|
30℃
120℃
|
GPa
|
2.6
2.0
|
2.7
2.1
|
2.4
2.8
|
|
CTE
|
α1
α2
|
Ppm
|
61
171
|
58
168
|
65
160
|
|
Peeling Strength ＞
|
|
N/cm
|
15
|
17
|
20
|
|
Water Absorption ＜
|
100℃/24hr
|
%
|
1.0
|
1.0
|
1.2
|
|
Water Absorption (after high temperature and high humidity)
|
85℃/85%/24hr
121℃/100%/24hr
|
%
|
0.7
1.3
|
0.7
1.2
|
0.7
1.6
|
|
KIC
|
|
N/㎡
|
26
|
24
|
23
|
|
IZCD Ballistic Test
|
|
KJ/m
|
17
|
15
|
18
|
|
Dielectric Constant
|
1MHz
1GHz
|
|
3.6
3.22
|
|
|
|
Dielectric loss Angle tangent
|
1MHz
1GHz
|
|
0.014
0.023
|
|
|
Contain biphenyl structure phenolic resin primarily chain NC - 3000 series of epoxy resin, due to its high hydrophobicity, making its condensate hygroscopicity decline, this helps hygroscopic again after flow welding enhancement. In this containing biphenyl type epoxy resin composition structure phenolic, aromatic ring holds a large proportion, this not only make condensate heat resistant improved, and when burnt can form more carbonization layer, make flame retardancy can be promoted. In epoxy resins with biphenyl structure exists, make crosslinking functional groups (epoxy groups) between molecular weight increases, its one-dimenion thermal elastic modulus is low, and with high toughness characteristics. NC - 3000 series cured expoxy resin content due to high toughness features, causes it that made of PCB under high temperature lead-free soldering produces in the process of stress decreased.
In NC - 3000 series, more suitable for high heat resistance (adaptive free-plumburm), no halogenating FR - type 4 CCL used varieties, is the newly launched NC - 3000 - H epoxy resin. It has an average molecular weight than NC - 3000 high. Its molecular weight of the enhancement, is the benzene by adjusting the resin with methylene group combine part of benzene adjacent bits/contrapuntal (o/p) tropism acquired. NC - 3000 - H epoxy resin major difference in NC - 3000 series other two strains of performance features are: it consists of 4 1/2 curing FR slice production with resin glue and have a good solvent dissolve stability. CER - 3000 - L have low melt viscosity, more emphasis on the characteristics of the epoxy encapsulation for IC packaging material.