Quick Details:
Numbers of layers:1 to 20-layer
Board Thickness:0.2-5.0mm
Min.Line Spacing/width:0.1mm/0.1mm

Numbers Of  layers: 4-layer

Material:Halogen Free

Board Thickness: 1.6mm

Base Meterial: FR-4

Min.Line Spacing: 0.1mm

Min.Line Width: 0.1mm

Min.Hole Size: 0.1mm

Copper Thickness:1OZ

Au plating thickness:  Min.0.05um

                   Max.1.5um

Soldermask ink: Green

Silkscree: White

V-grooving tolerance: Remain thickness:+/-0.1mm

Electrial testing: Max Test Voltage:250V

Surface Finishing: Immersion Gold

ISO9001/UL/Rohs certified

Quality report: Solderability test and Final inspection

Packaging&Delivery:

Packaging Detail: Vacuum package

Delivery Detail: 7 work days 

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