Product Name:

R.G-OUTRE Acid Bright Copper Plating Process

Model No.:

R.G-OUTRE

Classfication:

Acid Copper Plating Process

Feature:

 

1. Bath is easy to be controlled, high impurity tolerance, excellent plating levelling.

2. No pinholes on the plating. Low internal stress, nice extensibility

3. Wide range of current density, filling and levelling is as high as 75%, reaching to brighten effect.

4. Speed deposition and plating time could be shortened.

5. Plating has the advantage of low resistivity, so it is quite suitable for electric machine industry which has high demand for plating  physical properties

6. Could be applied to different kinds of base metal, iron parts zinc alloy parts, plastic parts .

7. High tolerance of impurities.

Copper Sulfate(CuSO4·5H2O)                          200-220g/L

Sulfuric Acid(density is1.84)                             70-150g/L(PPM)

Chlorideion                                                       50-90g/L

Ultra  Make Up                                                  4-8mg/L

Ultra  A                                                            0.4-0.6mg/L

Ultra  B                                                            0.4-0.6mg/L

Tempreture                                                     20-30℃

Cathode Density                                               1-6A/dm2

Anodic Density                                                 0.5-2.5A/dm2

Anode                                                            Phosphor Copper(0.01-0.03%phosphor)

Stirring Way                                                     Air and Mechnical Stirring