Name: Mobile Phone Board
Layers: 6L HDI
Thickness: 1.0mm
Inner Min line width / distance: 0.1mm/0.1mm
Outer Min line width / distance: 0.08mm/0.1mm
Minimum laser hole: 0.1mm
Minimum hole diameter: 0.2mm
Impedance: 50 ohms, plus or minus 10% tolerance
Fork points Impedance: 100 ohms, plus or minus 10% tolerance
Minimum BGA solder joints: 0.23mm
Surface treatment: OSP + Immersion Gold