Product Main

Specifications

Product Description
Desk Reflow Oven Features:

Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200N+ is a fine temperature profile model with temp testing capable of lead-free soldering.

— PC interface software control and visional operation

— Real-time temperature testing function fills the blank of SMT industry overall world for adjusting the temperature at the right time.

— Patented heater installation® For heating evenly

— Patented forced air cycling and ventilating technology® For extremely uniform temperature profiling across the board.

— Patented oven door actuating device ® For no vibration after PCB welding.

— Patented auto-open door technology® For higher efficiency on production and the door matched with seal device for keeping temperature.

— Active Ventilation function for exhaust gas emission.

— Exhaust purifying function for environment-friendly.

— Nitrogen inert and N2 saving design.
Temperature control segment 40 segment,
The segment can be set in computer according to the actual requirement.
Temperature-zone numbers Single-zone and multi-segment
Temperature control system PC control system ,SSR non-contact output
Temperature accuracy ± 2 ºC
Warm-up time 3min
Temperature range Room-temperature -360ºC
Heating supply Infrared ray + Hot air convection
Effective working table area 270mm * 230mm (more than A4)
Welding time 3min ± 1min
Temperature curve It can be set ,adjusted and tested according to the actual requirement .
Cooling system Transverse flow equal cooling
Rated voltage AC single-phase, 220V; 50Hz
Rated power 4.0KW
Mean power 1.8kw
Weight 45 kg
Dimension L * W * H 820′ 460 ′ 310mm