The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
Product features:
Later excluding halogen and other harmful substances,
Later printing, such as IC spacing good liquidity can good homework 0.4 mm,
Later welding few, smell is small, residues high insulation resistance, anti-corrosion PCB,
Later applicable requirements of different scale welding equipment and a long time printing,
Later can solder good, solder full light.
Application:
Apply to fine spacing solder paste printing and back to welding, suitable for welding, high nitrogen back preheated back welding, gold-plated,
Silver, nickel plating, spray tin, nude copper printed circuit board and so on many kinds.
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