Tin  Solder Paste is composed of environment-friendly flux and low oxidaton spherical powder,which were characterized by high print definition,excellent solderability and bright and smooth solder joint.

  Tin lead solder paste can meet all kinds assembly of electronics, and electrical products.

  1. Lead-free Solder Paste
Alloy Composition
Sn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \ Sn-58Bi
Lead-Contained Solder Paste
Alloy Composition
Sn63/Pb37 \ Sn62/Pb36/Ag2 \ Sn43/Pb43/Bi14
Sn10/Pb88/Ag2

   2.Basic concept and characteristic of Solder Paste
Solder paste is a cream-like mixture of solder alloy powder and flux/vehicle system;
Solder paste should be rheological, i.e., its viscosity will decrease under the action of shear stress to favor the printing process but recover afterward to help to fix the electronic components before reflow;
During the reflow process, the flux system will remove the surface oxidation layer and then the molten solder alloy will wet and react with the component terminal and metal pad on PCB and finally form the mechanical and electrical joining.
    3.Sorts of Solder Paste
By solder alloy composition, Pb-contained or Pb-free solder paste;
By cleaning method, Rosin based, water soluble or no-clean solder paste;
By flux type, Rosin, Rosin Medium Activated, Rosin Activated or Organic based solder paste;
By applying method, solder paste for stencil printing, screen printing or syringe dispensing.