Hotbar Bonding machine(JYHP-1A)
1.Closed Loop PID temperature control with visible LCD display.
2.LCD display programmable pressure switch for precise force control.
3.Each heating cycle is triggered by a real time pressure sensor.
4. Floating thermode ensures consistent pressure and heat transfer between
thermode head and the parts to be joined.
5. Silicon rubber can be fitted in bonding Heat Seal Connectors between LCD
and PCB.
6.Standard workpiece holder is mounted on a linear guideway and designed
to allow for easy changeover and repeatable operation.
7. Parts registration is adjusted by micrometer and secured by vacuum lock.
Optional CCD system for fine pitch component.
1.Closed Loop PID temperature control with visible LCD display.
2.LCD display programmable pressure switch for precise force control.
3.Each heating cycle is triggered by a real time pressure sensor.
4. Floating thermode ensures consistent pressure and heat transfer between
thermode head and the parts to be joined.
5. Silicon rubber can be fitted in bonding Heat Seal Connectors between LCD
and PCB.
6.Standard workpiece holder is mounted on a linear guideway and designed
to allow for easy changeover and repeatable operation.
7. Parts registration is adjusted by micrometer and secured by vacuum lock.
Optional CCD system for fine pitch component.
Specification:
|
Size |
550×640×630mm |
|
Working air pressure |
0.50-0.70Mpa |
|
Standard working area |
110×150mm |
|
Fixture |
1 set |
|
Temperature |
0-400℃ |
|
Temperature precision |
±2℃ |
|
Presssing time |
0-99S |
|
Thermode pressure |
0.1-0.6Mpa |
|
Weight |
62Kg |