1. layer:1-22
2. Board finished thickness:0.2mm-7.0mm
3 . Meterial:FR4,CEM-3,High TG,FR4 Halogen Free,Rogers
4. Max. Finished board size:580*900m
5. Min hole size:4mil(0.1mm)
6. Min trace width/space:3.5mil
7. Surface finishing/treatment:HASL/Lead free HASL,Imemersion sliver,immersion Tin,OSP
8. Copper thickness:0.5oz to 6oz
9. solder mask color:green/yellow/black/red/blue
10. Copper thickness in hole:>18um
11.Outline tolerance :+/-0.13mm
Hole size tolerance:PTH+/-0.076mm NPTH+/-0.05mm
12.Quality ensure:UL approval TS16949:2002
13.Buried and Blind vias,impedance control ,via plug,BGA soldering,Gold finger