We developed “SND series ”adhesive for chip mounting machines or SMD.They are one-part thermo-setting epoxy adhesive with the property of preservation stability, and are of 1 to 2 minute short time or high speed curability required for 120 to 150℃ heat-give SMD packaging.We are ready, in addition, to offer the adhesive of various grades with excellent micro-printability or with suitability for high-speed dispensers.
Packaging:200gr, 360gr,10cc,20cc,30ccsyringes,1000g is standard bottled
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SND5611
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SND5609
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Composition
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Epoxy resin
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Appearance
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Paste/ Red-colored/ Yellow-colored
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Specific gravity
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1.28
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1.38
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Viscocity at 25℃,5rpm
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300000cps
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390000cps
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Adhesive
strength
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2125C
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44N(4.5kgf)
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38N(3.9kgf)
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Mini-mold tr
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45N (4.6kgf)
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38N(3.9kgf)
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SOP-IC 16P
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92N(9.4kgf)
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92N(9.4kgf)
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Electric property
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Volume resistance
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2.6×1016Ω•cm
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1.8×1017Ω•cm
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Insulation resistance
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Initial value
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1.0×1014Ω
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3.4×1014Ω
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After treating
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1.2×1012Ω
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2.1×102Ω
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Dielectric constant
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3.62/1MHz
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3.8(100KHz)
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Dielectric loss tangent
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0.013/1MHz
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0.027/(100KHz)
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Preservation condition Keep in refrigeration below 2℃~10℃
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