High lead, high melting point alloys, lead content is more than 85%. Can meet the RoHS directive. Usually used in package of power semiconductor device, can Miscibility with Au, Cu, AG, high residual impedance and good welding strength. The halogen-related failure mode for die-attach solder pastes is the corrosion of wirebond pads on the topside of Power Semiconductor die which are soldered to the leadframe with halogen-containing solder paste.