Product Introduction
Ausbond 150 is a double-component black curable thermal-conductive & flame-retardant Epoxy Encapsulating, with low adhesive and excellent flow and it can penetrate into the gap of products; it can be solidified through normal temperature or heating with suitable speed of solidification; there is no bubble with plain and glazing surface and high hardness; the solidified materials have an excellent performance of anti-alkaline, waterproof, oil- proof and dust-proof,which is humid and thermal resistant and air aging;
it owns excellent electric and physical features of insulation, anti-pressing and high degree of adhesive.
Ausbond 150 is a double-component black curable thermal-conductive & flame-retardant Epoxy Encapsulating, with low adhesive and excellent flow and it can penetrate into the gap of products; it can be solidified through normal temperature or heating with suitable speed of solidification; there is no bubble with plain and glazing surface and high hardness; the solidified materials have an excellent performance of anti-alkaline, waterproof, oil- proof and dust-proof,which is humid and thermal resistant and air aging;
it owns excellent electric and physical features of insulation, anti-pressing and high degree of adhesive.
Typical Purposes
It is widely used for injection sealing protection and confidentiality of electronics of circuit module, power module, electronic component and PCB board.
Process Used
1. The product to be ejected should be dry and clean.
2. Group A and Group B should be fully mixed in separate container before mixture.
3. To weight correctively as per weight proportion and fully agitate it after proportional mixture to avoid the incomplete solidification.
4. Generally speaking, the pressure below 20mm can be free from bubble naturally; because the high temperature causes the faster speed or deeper of pressure depth, so the bubble can be free according to the requirement.The blender should be placed in the vacuum container in order to get rid of facial and internal bubble after the module
pressure; under 0.8MPa it should be free from bubble for at least 5 minutes.
5. The glue materials free from bubble should be poured into the products to be ejected; the ejected products can be solidified by normal temperature or heating.
6. Please keep the environment clean in the process of solidification in case of the admixture or dust falling on the surface of non-solidified glue liquid.
It is widely used for injection sealing protection and confidentiality of electronics of circuit module, power module, electronic component and PCB board.
Process Used
1. The product to be ejected should be dry and clean.
2. Group A and Group B should be fully mixed in separate container before mixture.
3. To weight correctively as per weight proportion and fully agitate it after proportional mixture to avoid the incomplete solidification.
4. Generally speaking, the pressure below 20mm can be free from bubble naturally; because the high temperature causes the faster speed or deeper of pressure depth, so the bubble can be free according to the requirement.The blender should be placed in the vacuum container in order to get rid of facial and internal bubble after the module
pressure; under 0.8MPa it should be free from bubble for at least 5 minutes.
5. The glue materials free from bubble should be poured into the products to be ejected; the ejected products can be solidified by normal temperature or heating.
6. Please keep the environment clean in the process of solidification in case of the admixture or dust falling on the surface of non-solidified glue liquid.
Package Specification
30kg/suite (group A 25kg+group B 5kg).
Storage and Transport
1. Store in the cool and dry place, with shelf life 12 months (25℃).
2. This product belongs to non-dangerous articles; please transport it as general articles.
3. For the product over storage life, please use it after confirming whether it is abnormal.
30kg/suite (group A 25kg+group B 5kg).
Storage and Transport
1. Store in the cool and dry place, with shelf life 12 months (25℃).
2. This product belongs to non-dangerous articles; please transport it as general articles.
3. For the product over storage life, please use it after confirming whether it is abnormal.