1.Lead free HASL PCB with Competitive price.
2.Rosh compliant.
3.Quick leadtime.
4.No MOQ request.
5.Final functional test.
2.Rosh compliant.
3.Quick leadtime.
4.No MOQ request.
5.Final functional test.
Blank PCB manufacturing capability:
| tem | Type | Standard capability |
| 1 | PCB layer | 1-6layer |
| 2 | PCB process | HASL,Flash gold,Immersion gold |
| 3 | Material | Fr4,CEM-1,MCPCB |
| 4 | copper foil | 0.5oz-5oz |
| 5 | board thickness | 0.3mm-3.8mm |
| 6 | Max work size | 480mmx600mm |
| 7 | Min work size | 20mmx20mm |
| 8 | Min hole size | 0.3mm |
| 9 | Min PTH hole | 0.5mm |
| 10 | Min line width/spacing | 0.1mm |
| 11 | Min copper foil | 350u-450u |
|
Description
|
Details Specification
|
|
|
Base Material
|
FR-4,Aluminium-backed board,Halogen-free,Lead-free compatible,High Tg,High CTI,CEM-1,CEM-3 etc.
|
|
|
|
Mass production
|
Sample
|
|
Max Dimension
|
630x530mm
|
630x530mm
|
|
Copper thickness of inner layer
|
18-140um
|
18-210um
|
|
Copper thickness of outer layer
|
12-210um
|
12-210um
|
|
Min.Annular ring
|
0.10mm
|
0.08mm
|
|
Min.solder mask clearance
|
0.05mm
|
0.05mm
|
|
Min.solder mask clearance
|
0.045mm
|
0.03mm
|
|
Impedance tolerance
|
±10%
|
±8%
|
|
Finished board thickness
|
0.25mm-3.5mm
|
0.20mm-4.0mm
|
|
Outline precision
|
±0.1mm
|
±0.08mm
|
|
Layers No.
|
2-12layers
|
2-14layers
|
|
Inner layer circuit
|
4/4mil
|
4/3mil or 3/4mil
|
|
Out layer circuit width/spacing
|
4/4mil
|
4/3mil or 3/4mil
|
|
Board Thickness
|
0.1-1.6mm
|
0.075-1.6mm
|
|
Min.drill bit size
|
0.2mm
|
0.15mm
|
|
Aspect ratio
|
8:01
|
10:01
|
|
Surface Finished type
|
HASL,Flash golds,ENIG,OSP(lead freecompatible),Carbon ink,Peelable S/M,HASL(lead free),Immersion silver/tin,Gold finger plating,ENIG+gold finger plating,Immersion Silver+gold finger plating
|
|
|
Production type
|
High precision multi-layer board,Blind hole board, Buyerd hole board,High frequency board,Aluminium backed board
|
|
|
Certificate
|
ISO9001.UL etc
|
|
PCB assembly Equipment:
A whole PCB assembly system= A SMD production line + A insertion production line + A hand soldering line
Quality Control:
1.Customers reconfirm the BOM list before components purchasing;
2.Ispect components when components arrived;
3.Samples confirm before mass production.
1.Customers reconfirm the BOM list before components purchasing;
2.Ispect components when components arrived;
3.Samples confirm before mass production.
4.FCT test for final assemly boards.