Green, crystal structure, high hardness and strong cutting ability, stable chemical characteristics, good thermal conductivity. Microcosmic shape is a hexagonal crystal, Mohs hardness is 9.3., Vickers hardness is 2940-3300kg/mm2, Vickers microhardness is 2670-2815kg/ mm2. Among abrasives, silicon carbide’s hardness is higher than corundum, and ranked below diamond, CBN and boron carbide. Density generally viewed is 3.20-3.25g/ cm3, natural bulk density is 1.2-1.6g/ cm3 , specific gravity is 3.20ï½ÂÂÂÂÂ?3.25. Raw materiasl are petroleum coke and quality silicon sand, appended with salt, then smelted in electric arc furnace. Mechanical strength is higher than corundum.
Main applications: solar and semiconductor wafer wire sawing; crystal and ferrite polishing; ceramic and special steel precision polishing; bonded and coated abrasive tools; cutting and polishing; non-ferrous metal lapping such as glass, stone, agate and high-grade jewelry; high-grade refractory materials , engineering ceramic, heating elements and thermal elements.
Application
For wire-sawing of solar and simi-conductor
Usage:
Green silicon carbide is used for wire-sawing of monocrystal silicon, polocrystalline silicon, potassium arsenide, quartz crystal, etc. It is the engineering processing material in solar photovoltaic industry, simi-conductor industry and piezoelectric crystal industry.
Feature:
1. High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition,
2. Grains are isometric with sharp edge, which ensure the even self-sharpening capability as cutting material and minimum TTV of the products been cutted.
3. Particle size distribution is narrow and even.
4. High heat-resisting and refractoriness under load guarantee the small wire expansion in processing, suitable to all kinds of wire saw machine.
5. Grain surface possessed specially, micro-powder with clean surface and easily fit cutting fluid, such as polyethyleneglycol and so on.
Main applications: solar and semiconductor wafer wire sawing; crystal and ferrite polishing; ceramic and special steel precision polishing; bonded and coated abrasive tools; cutting and polishing; non-ferrous metal lapping such as glass, stone, agate and high-grade jewelry; high-grade refractory materials , engineering ceramic, heating elements and thermal elements.
Application
For wire-sawing of solar and simi-conductor
Usage:
Green silicon carbide is used for wire-sawing of monocrystal silicon, polocrystalline silicon, potassium arsenide, quartz crystal, etc. It is the engineering processing material in solar photovoltaic industry, simi-conductor industry and piezoelectric crystal industry.
Feature:
1. High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition,
2. Grains are isometric with sharp edge, which ensure the even self-sharpening capability as cutting material and minimum TTV of the products been cutted.
3. Particle size distribution is narrow and even.
4. High heat-resisting and refractoriness under load guarantee the small wire expansion in processing, suitable to all kinds of wire saw machine.
5. Grain surface possessed specially, micro-powder with clean surface and easily fit cutting fluid, such as polyethyleneglycol and so on.
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Particle size distribution(micron)
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Chemical composition
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Physical composition
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Size
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D3
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D50
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D94
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SiC(%)
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Fe2O3
(%)
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F.C
(%)
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PH Value
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Bulk Density
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Magnetic material content (%)
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GC#800
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≤20.0
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14.0±1.0
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≥9.0
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≥99.00
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≤0.20
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≤0.2
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6-8
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1.18
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0.008
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GC#1000
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≤18.3
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11.5±1.0
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≥7.0
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≥98.50
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≤0.20
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≤0.2
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6-8
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1.15
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0.008
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GC#1200
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≤17.5
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9.5±0.8
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≥5.5
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≥98.50
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≤0.20
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≤0.2
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6-8
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1.13
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0.005
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GC#1500
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≤14.5
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8.0±0.6
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≥4.5
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≥98.00
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≤0.20
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≤0.2
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6-8
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1.12
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0.005
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GC#1800
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≤13.5
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7.0±0.6
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≥4.2
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≥98.00
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≤0.20
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≤0.2
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6-8
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1.05
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0.005
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GC#2000
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≤13.0
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6.7±0.6
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≥4.0
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≥98.00
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≤0.20
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≤0.2
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6-8
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1.00
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0.005
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Other specs can be supplied as clients' request.
If you need more details about our products, just feel free to contact me.