1.High quality USB circuit board.
2.Rosh compliant.
3.Quick leadtime.
4.No MOQ request.
5.Final functional testing.
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Description
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Details Specification
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Base Material
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FR-4,Aluminium-backed board,Halogen-free,Lead-free compatible,High Tg,High CTI,CEM-1,
CEM-3 etc.
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Mass production
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Sample
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Max Dimension
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630x530mm
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630x530mm
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Copper thickness of inner layer
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18-140um
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18-210um
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Copper thickness of outer layer
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12-210um
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12-210um
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Min.Annular ring
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0.10mm
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0.08mm
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Min.solder mask clearance
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0.05mm
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0.05mm
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Min.solder mask clearance
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0.045mm
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0.03mm
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Impedance tolerance
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±10%
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±8%
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Finished board thickness
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0.25mm-3.5mm
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0.20mm-4.0mm
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Outline precision
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±0.1mm
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±0.08mm
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Layers No.
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2-12layers
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2-14layers
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Inner layer circuit
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4/4mil
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4/3mil or 3/4mil
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Out layer circuit width/spacing
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4/4mil
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4/3mil or 3/4mil
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Board Thickness
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0.1-1.6mm
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0.075-1.6mm
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Min.drill bit size
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0.2mm
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0.15mm
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Aspect ratio
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8:01
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10:01
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Surface Finished type
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HASL,Flash golds,ENIG,OSP(lead freecompatible),Carbon ink,Peelable S/M,HASL(lead free),
Immersion silver/tin,Gold finger plating,ENIG+gold finger plating,Immersion Silver+gold finger
plating
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Production type
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High precision multi-layer board,Blind hole board, Buyerd hole board,High frequency board,
Aluminium backed board
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Certificate
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ISO9001.UL etc
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