Product Main

Specifications

HDI R-F Multilayer PCB with HASL Finishing
· Vendor to be UL recognized
· All patterns according to Customer PCB Artwork/Film/Gerber File.
· Material: FR-4 or other
· Date code location: Printed on Top/Bottom/Side Silkscreen Layer
· Etch on Top/Bottom/Side Copper Layer.
· All PCB will be electrical tested before shipment
· Legend Silkscreen: Top or Bottom side
· Solder mask color: Green/Blue/Yellow/Red/Other
· Complied ROHS standard
· Packing: Inner vacuum packing; Outer carton packing:
· FOB Port: Shenzhen or HK
HDI
Item
Mass Production
Prototype
HDI structure
1+N+1,1+1+N+1+1
2+N+2
Buried hole
Filled
Filled
Aspect ratio
0.75:1
0.75:1
Minimum laser hole
0.1mm(4mil)
0.1mm(4mil)
Minimum laser pad
0.25mm(10mil)
0.25mm(10mil)
Blind hole
No filled
No filled
Rigid & Flex board
NO
YES
Press fit hole
YES
YES
Control Depth drilling
YES
YES
Lead-free & Halogen-free
YES
YES
Immersion Gold
Ni: 2-5µ m Au: 0.05-0.10µ m
Ni: 3-6µ m Au: 0.075-0.15µ m
Immersion Tin
0.6-1.2µ m
0.6-1.2µ m
Immersion silver
0.2-0.6µ m
0.3-0.6µ m
OSP
0.1-0.4µ m
0.25-0.4µ m
HASL (Sn-Pb& LF)
Pad: > 3µ m /Big Cu: > 1µ m
Pad: > 4µ m Big Cu: > 1.5µ m
Flash Gold
Ni: 3-6µ m Au: 0.01-0.05µ m
Ni: 3-6µ m Au: 0.02-0.075µ m
 
If there is any question about HDI R-F Multi-Layer PCB with HASL Finishing, please don’ t hesitate to contact Mr. Cai