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Specifications

HDI R-F Multi-Layer PCB with HASL Finishing
· Vendor to be UL recognized
· All patterns according to Customer PCB Artwork/Film/Gerber File.
· Material: FR-4 or other
· Date code location: Printed on Top/Bottom/Side Silkscreen Layer
· Etch on Top/Bottom/Side Copper Layer.
· All PCB will be electrical tested before shipment
· Legend Silkscreen: Top or Bottom side
· Solder mask color:  Green/Blue/Yellow/Red/Other
· Complied ROHS standard
· Packing: Inner vacuum packing; Outer carton packing:
· FOB Port: Shenzhen or HK 
HDI
Item
Mass Production
Prototype
HDI structure
1+N+1,1+1+N+1+1
2+N+2
Buried hole
Filled
Filled
 Aspect ratio
0.75:1
0.75:1
 Minimum laser hole
0.1mm(4mil)
0.1mm(4mil)
 Minimum laser pad
0.25mm(10mil)
0.25mm(10mil)
 Blind hole
No filled
No filled
Rigid & Flex board
NO
YES
 Press fit hole
YES
YES
Control Depth drilling
YES
YES
Lead-free &Halogen-free
YES
YES
 Immersion Gold
Ni:2-5µm Au:0.05-0.10µm
Ni:3-6µm Au:0.075-0.15µm
Immersion Tin
0.6-1.2µm
0.6-1.2µm
 Immersion silver
0.2-0.6µm
0.3-0.6µm
 OSP
0.1-0.4µm
0.25-0.4µm
HASL (Sn-Pb&LF)
 Pad:>3µm /Big Cu:>1µm
Pad:>4µm Big Cu:>1.5µm
 Flash Gold
Ni:3-6µm Au:0.01-0.05µm
Ni:3-6µm Au:0.02-0.075µm
 
If there is any question about HDI R-F Multi-Layer PCB with HASL Finishing, please don’t hesitate to contact Mr. Cai