HDI R-F Multi-Layer PCB with HASL Finishing
· Vendor to be UL recognized
· All patterns according to Customer PCB Artwork/Film/Gerber File.
· Material: FR-4 or other
· Date code location: Printed on Top/Bottom/Side Silkscreen Layer
· Etch on Top/Bottom/Side Copper Layer.
· All PCB will be electrical tested before shipment
· Legend Silkscreen: Top or Bottom side
· Solder mask color: Green/Blue/Yellow/Red/Other
· Complied ROHS standard
· Packing: Inner vacuum packing; Outer carton packing:
· FOB Port: Shenzhen or HK
|
HDI
|
||
|
Item
|
Mass Production
|
Prototype
|
|
HDI structure
|
1+N+1,1+1+N+1+1
|
2+N+2
|
|
Buried hole
|
Filled
|
Filled
|
|
Aspect ratio
|
0.75:1
|
0.75:1
|
|
Minimum laser hole
|
0.1mm(4mil)
|
0.1mm(4mil)
|
|
Minimum laser pad
|
0.25mm(10mil)
|
0.25mm(10mil)
|
|
Blind hole
|
No filled
|
No filled
|
|
Rigid & Flex board
|
NO
|
YES
|
|
Press fit hole
|
YES
|
YES
|
|
Control Depth drilling
|
YES
|
YES
|
|
Lead-free &Halogen-free
|
YES
|
YES
|
|
Immersion Gold
|
Ni:2-5µm Au:0.05-0.10µm
|
Ni:3-6µm Au:0.075-0.15µm
|
|
Immersion Tin
|
0.6-1.2µm
|
0.6-1.2µm
|
|
Immersion silver
|
0.2-0.6µm
|
0.3-0.6µm
|
|
OSP
|
0.1-0.4µm
|
0.25-0.4µm
|
|
HASL (Sn-Pb&LF)
|
Pad:>3µm /Big Cu:>1µm
|
Pad:>4µm Big Cu:>1.5µm
|
|
Flash Gold
|
Ni:3-6µm Au:0.01-0.05µm
|
Ni:3-6µm Au:0.02-0.075µm
|
If there is any question about HDI R-F Multi-Layer PCB with HASL Finishing, please don’t hesitate to contact Mr. Cai