Lithography GK2
GK2 lithography is used in the LSI, sensor, surface wave component, magnetic bubble, microwave, CCD and so on.
Lithography GK2 Technical parameter:
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Item
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Parameter
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The size
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a.100X100X2－3mm; b.75X75X2—3mm; c.63X63X2—3(can choose);
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Silicon size
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φ35—75mm
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The line
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3-4μm, The thinnest can be 2μm
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Mask and silicon displacement range
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X/Y±2.5mm,(rotation) ±6°
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Worktable rotate around the principal axis
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Coarse adjustment 360° can be fine adjusted.
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Worktable moving range
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X,Y compose φ75mm
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The? worktable’s tee surface to the moulding board
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0—7.5mm
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Exposal light
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GCQ200W over high pressure HG light, Exposal wave length, 300―436nm
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Exposal system should be above?
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7mw
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Exposal system uniformity of illuminance range should be in φ75mm |
±5％
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Microscopical lighting wave length
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≈545nm
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Time of exposure control range
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0.1 sec—99 min
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Amplification of the binocular microscope
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a. Two kinds ocular:10X,16X; b. Three kind plan objective :6X,9X,15X; c.Composed magnification ratio.:60X—240X; |
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Vacuum contact pressure
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≥0.7kgf
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Dimension
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1000X850X980mm(two pcs)
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Weight
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200kg
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