1. Product Description
2. Features
MaRS Silicon based V-Groove chips assist in producing high performance photonic devices. Made through high-precision silicon etching, the V-groove chip can achieve precise alignment of either ribbonized or individual fibers. The buffer area offers extra strength and rigidity to reduce breakage. Metallized chips can be welded directly with metallization fiber for non-epoxy applications.
2. Features
l Up to 32 channel V-groove arrays or customized
l Suitable for125/250μm diameter singlemode, multimode and polarization maintaining fibers, or customized
l Channel spacing127μm and 250μm, or customized
l Selective surface metallization
l Compatible with Telcordia standard
4. Specifications
3. Applications
l Pigtailing of integrated optical devices
l Connection to planar waveguide devices
l Construction of DWD Mmultichannel devices
l Connection and feedback for optical sensing devices
l Attachment to an array of active devices
l Connection of MEMS devices
4. Specifications
|
Part Number
|
Channel Number
|
Channel Spacing
|
Chip Length
|
Chip Width
|
Edge Distance
|
Chip Thickness
|
|
P/N
|
N
|
S(mm)
|
L(mm)
|
W(mm)
|
ED(mm)
|
T(mm)
|
|
MTT-SVG-1-250-10-2.5-1
|
1
|
N/A
|
10
|
2.5
|
1.250
|
1
|
|
MTT-SVG-2-250-8.01-2.5-1
|
2
|
250
|
8.01
|
2.5
|
1.075
|
1
|
|
MTT-SVG-4-250-8.15-2.5-1
|
4
|
250
|
8.15
|
2.5
|
0.875
|
1
|
|
MTT-SVG-8-127-10-2.8-1
|
8
|
127
|
10
|
2.8
|
0.955
|
1
|
|
MTT-SVG-8-250-8.15-3.2-1
|
8
|
250
|
8.15
|
3.2
|
0.725
|
1
|
|
MTT-SVG-16-127-12-3.2-1
|
16
|
127
|
12
|
3.2
|
0.647
|
1
|
|
MTT-SVG-32-127-12-5.7-1
|
32
|
127
|
12
|
5.7
|
0.881
|
1
|
|
MTT-SVG-64-127-12-10-1
|
64
|
127
|
12
|
10
|
1.000
|
1
|