|
NO.
|
ITEM
|
INDEX
|
|
01
|
Surface treatment
|
HAL(lead free), Immersion Gold, OSP
|
|
02
|
Layer
|
Single-sided, double-sided, multilayer and special structure layer
|
|
03
|
Max size
|
1200mm*600mm
|
|
04
|
PCB thickness
|
0.5-3.3mm
|
|
05
|
Copper foil thickness
|
H 1 2 3 4 5 6 10(OZ)
|
|
06
|
Insulating layer thickness
|
50 75 100 125 150 micron
|
|
07
|
Metal base type
|
Aluminum, Ferrum, Copper, Stainless steel
|
|
08
|
Metal base thickness
|
0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm)
|
|
09
|
Shaping
|
Die Punching, CNC Route, CNC V-Cut
|
|
10
|
Testing
|
100% Compute Short/Open Circuit Test
|
|
11
|
The Minimum Hole Diameter
|
single-sided 0.8mm, PTH 0.3mm
|
|
12
|
The Minimum Pad Size
|
1.2mm
|
|
13
|
The Minimum PTH Distance
|
2.0mm
|
|
14
|
The Minimum Line Width
|
0.1mm
|
|
15
|
The Minimum Increase of Solder Mask
|
0.15mm
|
|
16
|
The Minimum Pad
|
10um
|
|
17
|
Solder Mask Color
|
green, white, black, red, yellow
|
|
18
|
The Minimum Letter Width
|
0.15mm
|
|
19
|
The Minimum Letter Height
|
0.8mm
|
|
20
|
Letter Color
|
white, black, blue, yellow, red
|
