Product Introduction
Ausbond®189 is a kind of single-component room temperature cured heat conduction silicon glue.
1. Single-component, room temperature cure,easily use and it doesn’t need the latch and screw to fix.
2. It owns the performance of heat conduction,dissipation and paste.
3. The neutral room temperature cure and high cure speed has an excellent adhesive for most metal without erosion; it won't fall and the heat dissipation effectiveness won't be reduced due to the touching of gap.
4. The glue layer has good high-temperature and low-temperature resistance performance, aging resistance performance, electricity insulation performance and excellent damp-proof,mildew-proof, salt fog-proof and electric leakage resistance performance.
5. It can conform to the requirements of EU ROHS Directive completely.

Typical Purposes
It is used for the heat conduction and insulation between dissipation slice and CPU as the media passing heat, such as CPU and coolermaste,thyristor module and coolermaste; the filling, paste and heat dissipation between high power component and heat dissipation.

Package Specification
100ml/piece, 100 pieces/case; 300ml/piece, 24 pieces/case.
Storage and Transport
1. Store in the cool and dry place, with shelf life 9 months (25℃).
2. This product belongs to non-dangerous articles;please transport it as general articles.