Product Main

Specifications

ZX-C2 bga rework station
Features:
1. With controller and button to control the machine manual. Adjust height of top heater by hand, with vacuum pen to pick BGA manual after reflow.
2. Top and bottom heater use hot air, 3rd heater use IR to preheat whole PCB board. Bottom heater can adjust up and down to support the bottom of BGA.
3. Top and bottom heater can set 8 segments heating, cooling and constant temperature, save 10 groups temperature profile. IR heater start heating at the same time with top and bottom heater.
4. Three heater use independent PID control, heating process is more accurate and uniform.
5. Bottom heater equipped with support, can adjust up and down to support bottom side of PCB board to prevent deformation.
6. There is support on top of IR heater to prevent PCB deformation.
7. Cross-flow fan to cool PCB board after remove and reflow to ensure welding effect.
SPECIFICATION
PCB Size
≤L540×W450mm
PCB Thickness
0.1~5mm
Temperature Control
K thermocouple  PID Closed loop
PCB Positioning mode
Outer
Bottom preheat
Infrared  2400W
Main (Top+bottom) heater
Hot air  800W+800W
Power supply
Single phase  220V,50/60Hz,4.2KVA
Dimension
L570×W560×H560mm
Weight
Approx. 39kgs