ZX-C1 bga rework station
Suitable to repair laptop,pc,mobile,xbox360,ps3 motherboard and so on
Three independent heater,use hot air and IR to heat
Vary easy to operate,cost-effective
Suitable to repair laptop,pc,mobile,xbox360,ps3 motherboard and so on
Three independent heater,use hot air and IR to heat
Vary easy to operate,cost-effective
Features:
1. With controller and button to control the machine manual. Adjust height of top heater by hand, with vacuum pen to pick BGA manual after reflow.
1. With controller and button to control the machine manual. Adjust height of top heater by hand, with vacuum pen to pick BGA manual after reflow.
2. Top and bottom heater use hot air, 3rd heater use IR to preheat whole PCB board. Bottom heater can adjust up and down to support the bottom of BGA.
3. Top and bottom heater can set 8 segments heating, cooling and constant temperature, save 10 groups temperature profile. IR heater start heating at the same time with top and bottom heater.
4. Three heater use independent PID control, heating process is more accurate and uniform.
5. Bottom heater equipped with support, can adjust up and down to support bottom side of PCB board to prevent deformation.
6. There is support on top of IR heater to prevent PCB deformation.
7. Cross-flow fan to cool PCB board after remove and reflow to ensure welding effect.
SPECIFICATION
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PCB Size
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≤L540×W450mm
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PCB Thickness
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0.1~5mm
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Temperature Control
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K thermocouple PID Closed loop
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PCB Positioning mode
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Outer
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Bottom preheat
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Infrared 1800W
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Main (Top+bottom) heater
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Hot air 800W+800W
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Power supply
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Single phase 220V,50/60Hz,3.6KVA
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Dimension
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L570×W560×H560mm
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Weight
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Approx. 34kgs
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