Features:
1. 5.7 inch touch screen control, adjust height of top heater manual and pick BGA   component with suction pen after reflow manual.

2. Top and bottom heater use hot air, 3rd heater use IR to preheat whole PCB board. Bottom heater can adjust up and down to support the bottom of BGA.

3．Three independent heater all can set 9 segments heating, cooling and constant temperature, save 40 groups temperature profile.

4. Three heater use independent PID control, heating process is more accurate and uniform.. It will display 3 actual temperature profile and 1 external temperature profile during heating process.

5. Bottom heater equipped with support, can adjust up and down to support bottom side of PCB board to prevent deformation.

6．There is support on top of IR heater to prevent PCB deformation. Cross-flow fan to cool PCB board after remove and reflow to ensure welding effect.

7．Nozzle of top and bottom heater can be 360 degree rotary, easy to change.

8．With different size of nozzle or customized.

9．Built-in vacuum pump, no need source..

SPECIFICATION