· Vendor to be UL recognized
· All patterns according to Customer PCB Artwork/Film/Gerber File.
· Material: FR-4 or other
· Date code location: Printed on Top/Bottom/Side Silkscreen Layer
· Etch on Top/Bottom/Side Copper Layer.
· All PCB will be electrical tested before shipment
· Legend Silkscreen: Top or Bottom side
· Solder mask color: Green/Blue/Yellow/Red/Other
· Complied ROHS standard
· Packing: Inner vacuum packing; Outer carton packing:
· FOB Port: Shenzhen or HK
HDI
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Item
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Mass Production
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Prototype
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HDI structure
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1+N+1,1+1+N+1+1
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2+N+2
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Buried hole
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Filled
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Filled
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Aspect ratio
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0.75:1
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0.75:1
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Minimum laser hole
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0.1mm(4mil)
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0.1mm(4mil)
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Minimum laser pad
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0.25mm(10mil)
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0.25mm(10mil)
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Blind hole
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No filled
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No filled
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Rigid & Flex board
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NO
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YES
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Press fit hole
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YES
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YES
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Control Depth drilling
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YES
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YES
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Lead-free &Halogen-free
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YES
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YES
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Immersion Gold
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Ni:2-5µm Au:0.05-0.10µm
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Ni:3-6µm Au:0.075-0.15µm
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Immersion Tin
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0.6-1.2µm
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0.6-1.2µm
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Immersion silver
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0.2-0.6µm
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0.3-0.6µm
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OSP
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0.1-0.4µm
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0.25-0.4µm
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HASL (Sn-Pb&LF)
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Pad:>3µm /Big Cu:>1µm
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Pad:>4µm Big Cu:>1.5µm
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Flash Gold
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Ni:3-6µm Au:0.01-0.05µm
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Ni:3-6µm Au:0.02-0.075µm
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