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Item |
Capabilities |
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Number of Layers |
From 4-layer to 22- Layer |
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Material |
FR-4,HighTg, Rogers Halogen Free |
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PCB Thickness |
Min.thickness |
0.4mm(16mil) |
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Max.thickness |
3.2mm(128mil) |
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Surface finished |
Gold Plating |
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Immersion Gold(Silver) |
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HAL Lead Free |
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Hot Air Solder Leveling(HASL) |
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Entek Coating (OSP) |
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Solder Mask |
Green,White,Black,Yellow,Red,Blue |
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Other printing |
Gold Finger |
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Carbon Print, Peelable Mask |
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Solder Mask Plugged Hole |
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Copper thickness |
1/ 2 oz (18 μm) - 4 oz (140 μm) |
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Min. Finished Hole Size |
0.2mm(8mil) |
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Hole Size Tolerance (PTH) |
+/ -0.076mm (3 mil) |
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Hole Size Tolerance (NPTH) |
+/-0.05mm (2 mil) |
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Min. Line Width and Spacing |
0.1mm (4 mil) |
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Min. Solder Mask Clearance |
0.05mm (2 mil) |
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Min. Annular Ring |
0.076mm (3mil) |
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Profile and V-Cut |
CNC-Routing, Stamping and Beveling,V-CUT,CNC |
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Special Process |
Micro-section, Chamfer for Gold Finger |
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File format |
Gerber file , CAM350 ,Protel,PowerPCB |
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E-TEST |
Flying Prob , E-test ,Fixture |
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Other Test |
Impedance , Slice up |
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Warp & Twist |
≤0.7% | |
