. Minimum line width: 0.1 mm (4 mil)
. Minimum line space: 0.1 mm (4 mil)
. Minimum hole diameter: 0.25 mm (10 mil)
. PTH hole diameter tolerance: +/-0.076 mm (+/-3 mil)
. NPTH hole diameter tolerance: +/-0.03 mm (+/-1.2 mil)
. Maximum board size: 460 x 620 mm (18 x 24)
. Board finishing type: hot air leveling, soft gold, hard
gold, immersion gold, gold fingers
Base material: FR4, CEM-1,
. Board thickness: 0.30 to 3.20 mm (12 to 26 mil)
. Copper thickness: 0.50 to 5 ounce
. Solder mask: LPI solder mask, conventional solder mask,
Peelable solder mask, UV solder mask