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Specifications

PCBA assembly (Lead free, RoHS compliant)
Hi-Tek Circuit can provide you all kinds of PCBA, PCB assembly, circuit assembly, board assembly, SMD assembly, DIP assembly, EMS PCBA.
1. Surface Mounted Technology Assembly (SMD)
2. Through Hole Technology Assembly (THT)
3. Profiling: Punching, Routing, V-cut, Beveling
4. Material based: CME1, CME3, FR4, High TG FR4, Halogen-free FR4, Aluminum, Ceramic, PTFE(F4B, F4BK), Rogers(4003, 4350, 5880), Taconic, Arlon(35N, 85N), etc.
5. Max. size: 1200mm*2000mm
6. Board Thickness: 0.25-6.00mm
7. Min. Trace Space: 0.075mml
8. Min. Laser Hole Size: 0.075mm
9. Copper Thickness: 0.5oz-5oz
10. Min.hole ring: 0.075mm
11. Hole position/Tolerance: ±0.05mm / ±0.075mm
12. Special requirements: Buried & Blind vias + Controlled impedance + BGA
13. Certificates: UL, ISO9001:2000,RoHS
14. Test: 100% Function-tested
15. anti-static bag packing and export carton
16. DHL, UPS, FedEx, TNT (door to door)