today`s fast BGA Rework environments (R).

Products apply to the welding of CBGA CCGA CSP QFN MLF PGA, all the green epoxy type BGA chip

and other special parts such as metal shielding cover, plastic connector replacement of various

and soft PCB.

Machine comes along with Manual and video demonstration CD-ROM,The information is easy to

understand. Even if you have never engaged in BGA rework , it can be quickly mastered the

technology

You’ll find its really the machine you need by its high integration Design, the smaller

workbench, non-mixed cables and the convenient operation –all the process of soldering

controlled by a button. Machine overall system integration Design, Rework station more

integrated workbench area by area occupied by smaller, Didn’t mixed and disorderly of cables,

use of one-button control, the ease of operation

The height of Top heating head may adjust by rotating the handle. The Top Infrared heater could

rework BGA ICs of large size up to 70*70mm. The top& bottom temperature areas heat

independently testing temperature, senstive temperature measurement sensor to obtain an

accurate and instantaneous temperature reading and monitoring. The techology of closed-loop

temperature control ensures accurate temperature process and even heat distribution.

The Linear guide type Bracket for BGA Reworks can be locked,adjusted by rotating the handle, It

can fix PCB board easily, effectively prevent PCB board from deformation.

IR 6000 can be connected to a computer with a built-in PC RS232 serial port. It can be

controlled by the software. it can set up 8 rising temperature segments and 8 constant

temperature segments to control. It can save 10 groups of temperature curves at one time

The innovative design gets over the problem of ir heating rework station heating slowly and

disorderly caused by the air flow. It can easy deal with the solder free soldering. The max

temperature is up to 400 °C. It can easily deal with lead –free soldering work.

 

Products apply to CBGA,CCGA,CSP,QFN,MLF,PGA and all the green epoxy type μBGA chip Welding and other special parts like metal shielding cover,plastic connector,replacement of various,soft pcb etc.

Machine with Use Manual and live video demonstration CD-ROM,

The information easy to understand,

combined with the platform ease of use, even if you have never engaged in BGA rework can be quickly mastered the technology.

 

Power:   1300W
Voltage:  220V 50 / 60 HZ
Weight:  Appox 18KGs
Size:     475 mm×480 mm×420 mm