1.Layer:1-22
2.Board finished thickness:0.2mm-0.7mm
3.Meterial:FR4,CEM-3,High TG,FR4 Halogen Free.Rogers
4. Max finished board size :580*900m
5. Min hole size:4mil(0.1mm)
6.Min trzce width/spzce:3.5mil
7.Surface finishing/traetment:HASL/Lead free HASL,imemersion sliver,immersion   Tin,OSP
8.Copper  thickness :0.5oz to 6oz
9.solder mask color :green/yellow/black/red/blue
10.Copper thickness in hole:>18um
11.Outline tolerance:+/-0.13mm Hole size tolerance :PTH+/-0.076mm NPTH+/-0.05mm
12.Quality ensure:UL approval TS16949:2002
13.Buried and blind vias,impendence control,via plug,BGA soldering,Gold finger