1.Layer:1-22
2.Board finished thckness:0.2mm-0.7mm
3.Meterial:FR4,CEM-3,High TG,FR4 Halogen Free,Rogers
4.Max Finished board size:580*900m
5.Min hole size:4mil(0.1mm)
6.Min trace width/spzce:3.5mil
7.Surfing finishing/traetment:HASL/Lead free HSAL,imemersion sliver,immersion Tin,OSP
8.Copper thickness:0.5oz to 6oz
9.solder mask color:green/yellow/balck/red/blue
10.Copper thickness in hole:>18um
11.Outline tolerance:+/-0.13mm
Hole size tolerance:PTH+/-0.076mm NPTH+/-0.05mm
12.Quality tolerance:U/L approval TS16949:2002
13.Buried and blind vias,inpendance control ,vig plug,BGA soldering,Golg finger
2.Board finished thckness:0.2mm-0.7mm
3.Meterial:FR4,CEM-3,High TG,FR4 Halogen Free,Rogers
4.Max Finished board size:580*900m
5.Min hole size:4mil(0.1mm)
6.Min trace width/spzce:3.5mil
7.Surfing finishing/traetment:HASL/Lead free HSAL,imemersion sliver,immersion Tin,OSP
8.Copper thickness:0.5oz to 6oz
9.solder mask color:green/yellow/balck/red/blue
10.Copper thickness in hole:>18um
11.Outline tolerance:+/-0.13mm
Hole size tolerance:PTH+/-0.076mm NPTH+/-0.05mm
12.Quality tolerance:U/L approval TS16949:2002
13.Buried and blind vias,inpendance control ,vig plug,BGA soldering,Golg finger

