1. layer:1-22
 

2. Board finished thickness:0.2mm-7.0mm
 

3 . Meterial:FR4,CEM-3,High TG,FR4 Halogen Free,Rogers
 

4. Max. Finished board size:580*900m
 

5. Min hole size:4mil(0.1mm)
 

6. Min trace width/space:3.5mil
 

7. Surface finishing/treatment:HASL/Lead free HASL,Imemersion sliver,immersion Tin,OSP
 

8. Copper thickness:0.5oz to 6oz
 

9. solder mask color:green/yellow/black/red/blue
 

10. Copper thickness in hole:>18um
 

11.Outline tolerance :+/-0.13mm
 

Hole size tolerance:PTH+/-0.076mm NPTH+/-0.05mm
 

12.Quality ensure:UL approval TS16949:2002
 

13.Buried and Blind vias,impedance control ,via plug,BGA soldering,Gold finger