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Specifications

18 layers buried&blind via printed circuit board
Base material: FR-4 High-Tg
Copper thickness:0.5oz
Layer thickness:18
Board thickness:1.6mm
Min hole size:0.2mm
Min line width/spacing:4/4mil
Surface finishing:immersion gold

If you send us your Gerber Files and PCB specifications, we will quote for you within 1 hour.
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