Micro SD card Push B type

1. Material:

    Housing: High Temperature material UL94V-0.

    Contact: Copper Alloy.

    Shell: Copper Alloy.

2. Plating

    Contact area: gold plated over Ni.

    Solder Tails: 100u" Min. Sn plated over Ni.   

    Shell solder area: Gold plated over Ni.

3. Eletrical specs:

    Contact Resistance:100m ohms Max.

    Dielectric Withstanding Voltage: 500VAC/1minute

    Insulation Resistance: 100MΩ Min. at 250VDC

    Operating Voltage: 250V(AC/DC)

    Current Rating: 0.5A

    Operating Temperature: -25 to +90 degree.

    Mating Cycle: 10000cycles

 

Packing type:

Normally use reel/ tape packing,1000pcs per reel, but we can do as for your need.

Delivery : 1-2 weeks around.