Card Module Bonding Machine YCB-1 430×650
This machine adopts high-speed servo system and highly stable and precise spot welder with HF contravariant resistance, which is characterized with high precision, high stability and high speed.
Technical parameters
- Applicable layout:2×4, 2×5, 3×7, 3×8, 3×10, 4×8, 4×10
- Applicable material (carrier) :Plastic PVC, ABS, PETG etc.
- Applicable material (copper wire) :0.10-0.15mm
- Number of weld head:1
- Size of work table:430x650
- Control: Multiaxial controller + PLC + touch screen
- Spot welder:1 set, 9kVA
- Compressed air:0.6MPa
- Air consumption:5 liter/min.
- Power supply: AC380V, 3-phase with 5-wire
- Power:2.5kW
- Weight:800kg
- Dimension: L1350×W780×H1300
| LK Product Catalog | |||
| Sort | No. | Name & Model | |
| Contactless IC card processing equipment | 1 | Smart Card Antenna Embedding Machine YCA-13 | |
| 2 | Smart Card Antenna Embedding Machine YCA-23 | ||
| 3 | Smart Card Antenna Embedding Machine YCA-14 | ||
| 4 | Smart Card Antenna Embedding Machine YCA-24 | ||
| 5 | Smart Card Antenna Embedding Machine YCA-15 | ||
| 6 | Smart Card Antenna Embedding Machine YCA-25 | ||
| 7 | Smart Card Module Bonding Machine YCB-11 | ||
| 8 | Smart Card Module Bonding Machine YCB-13 | ||
| 9 | Smart Card Module Bonding Machine YCB-23 | ||
| 10 | Smart Card Module Bonding Machine YCB-14 | ||
| 11 | Position Hole Punch Machine YCPP-2A | ||
| 12 | Automatic Hole Punch Machine YCPH-4A | ||
| 13 | Module Cutting Machine YCPM-3A | ||
| Contact IC card processing equipment | Automatic | 14 | Automatic IC Card Milling Machine YC-ICM |
| 15 | Automatic IC Card Embedding Machine YC-ICE | ||
| Semi-Automatic | 16 | Semiautomatic IC Card Milling Machine YC-ICSM | |
| 17 | Semiautomatic IC Card Embedding Machine YC-ICSE | ||
| 18 | Semiautomatic IC Card Module Die-Cutter Machine YC-ICSP | ||
| SIM card processing equipment | 19 | SIM Card Plug-in Punch Machine YC-ICP | |
| Card Laminator | Single tower | 20 | Laminator YCY-115B 420×520 |
| 21 | Laminator YCY-115C 250×350 | ||
| 22 | Laminator YCY-115F2 250×350 | ||
| 23 | Laminator YCY-115FA3 350×500 | ||
| 24 | Laminator YCY-115Z 425×520 | ||
| Double tower | 25 | Laminator YCY-215A 550×640 | |
| 26 | Laminator YCY-215B 450×655 | ||
| 27 | Laminator YCY-215D 420×520 | ||
| 28 | Laminator YCY-215H 350×500 | ||
| 29 | Laminator YCY-215M 250×350 | ||
| 30 | Laminator YCY-215MA3 350×500 | ||
| 31 | Laminator YCY-215X 550×750 | ||
| Card Punch machine | 32 | Card Punch Machine YCK-2AM 2×5 | |
| 33 | Automatic Card Punch Machine YCK-2A 2×5 | ||
| 34 | Automatic Card Punch Machine YCK-3A 3×10 | ||
| 35 | Automatic Card Punch Machine YCK-4A 4×10 | ||
| 36 | Automatic Card Punch Machine YCK-5A 5×5 | ||
| Embosser | 37 | Embosser YCT-3 | |
| Special shape card processing equipment | 38 | Special shape card Punch Machine YC-TAGP | |
| Hot Stamping | 39 | Position Hot Stamping Machine YCH-6000 | |
| Magnetic strip spot bonding | 40 | Magnetic Strip Spot Bonding Machine YCM-3×8 | |
| 41 | Magnetic Strip Spot Bonding Machine YCM-4×8 | ||
| 42 | Magnetic Strip Spot Bonding Machine YCM-4×5 | ||
| 43 | Magnetic Strip Spot Bonding Machine YCM-5×5 | ||
| Spot bonding | 44 | Spot Bonding Machine YCD-2 | |
| 45 | Spot Bonding Machine YCD-3 | ||
| Assistant equipment | 46 | Turn plate equipment YCY-FB 470×520 | |
| 47 | Lifter YCL-215D 420×520 | ||
| Personalized Data equipments | 48 | Smart Card Personalized Data Writer YLG-A | |
| 49 | Smart Card Personalized Data Writer YLG-E | ||
| 50 | Smart Card Module Personalized Data Writer YLM-A | ||