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Specifications

 
 
 
Semiautomatic IC Card Module Cutting Machine YC-ICSP
 
Semiautomatic IC Card Module Cutting Machine YC-ICSP is used to cut the modules on the strip.
 
Technical parameters
  • Punch IC to get IC form packing strip.
  • Dimension: L600×W300× H300mm
  • Equipment Weight: 30 kg
  • Air-press: 5-6kg/cm2, 10 l / min
  • Power supply: AC220V, 50/60 Hz
  • Power: 0.35 kW
  • Capacity: 2000pcs per hour
  • Control model: Relay control
  • Operator: 1
Our machines include:

 

contactless IC card processing equipment( Inlay machines),card laminator,card punching machine,SIM card making machines,special shape card punching machine (3-tag machine),hot stamping machine,magnetic strip spot bonding machine,spot bonding machine,personalized Data equipments, etc.