The HCH high performance, thermally conductive silicon pad designed with extremely high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.
Features & benefits:
●High compressibility, soft and flexible, designed for
applications in low-stress application environment
● Nice thermal conductivity
● Electrical insulation
● Meet with the environmental requirements of ROHS and UL
● Natural stickiness
Typical applications:
● Laptop
● Communication hardware equipment
● High-speed hard disk drive equipment
● Automobile engine control mould
● Micro processor, memory chip and graphics processor
● Mobile equipment
Physical properties:
|
Test item
|
Test method
|
Unit
|
Test value of HCH series
|
|
|
HCH600 value
|
HCH500 value
|
|||
|
Color
|
Visual
|
|
Blue/ Laterite
|
Blue/Yellow
|
|
Thickness
|
ASTM D374
|
Mm
|
0.25 to 5.0
|
0.25 to 5.0
|
|
Specific Gravity
|
ASTM D792
|
g/cc
|
2.85
|
2.7
|
|
Hardness
|
ASTM D2240
|
Shore C
|
30
|
30
|
|
Tensile strength
|
ASTM D412
|
kg/cm2
|
55
|
55
|
|
Continuous Use Temp
|
EN 344
|
ºC
|
-40 to 220
|
-40 to 220
|
|
Volume Resistivity
|
ASTM D257
|
Ω-cm
|
3.1*1011
|
3.1*1011
|
|
Breakdown voltage
|
ASTM D149
|
KV/mm
|
>5.0
|
>5.0
|
|
Flame Rating
|
UL-94
|
|
V-0
|
V-0
|
|
Conductivity
|
ASTM D5470
|
w/m-k
|
6.0
|
5.0
|
Configurations available: 200mm*400mm, 300mm*400mm; specific size could be provided according to your requirements.