lead free pcb:
·Blind and Buried via PCB
·Immersion gold plating PCB
·High frequency PCB
·High TG (170C) PCB
·Free halogen PCB
·Impedance control PCB
·Different PCB surface finish: HAL, Flash gold, Immersion gold
·Colorful solder mask PCB
·PCB Bwith Bridge Connecting
·RoHS
·Immersion gold plating PCB
·High frequency PCB
·High TG (170C) PCB
·Free halogen PCB
·Impedance control PCB
·Different PCB surface finish: HAL, Flash gold, Immersion gold
·Colorful solder mask PCB
·PCB Bwith Bridge Connecting
·RoHS
|
Layer Count
|
1-22 layers HDI
|
|
Material
|
CEM1,CEM3,FR-4,High TG FR4,halogen-free FR4,aluminium,ceramic etc
|
|
.Maximum Size
|
610mm×1200mm
|
|
Board thickness
|
0.125mm-6.0mm
|
|
.Minimum Line/Space
|
0.075mm
|
|
Minimum Drilling Hole(Mechanical)
|
0.15mm
|
|
Minimum Laser Hole
|
0.075mm
|
|
Copper Thickness
|
17µm-175µm
|
|
Mini Solder Mask Bridge
|
0.025mm
|
|
Impedance Control Tolerance
|
1.±5%
|
|
Surface finishing
|
HASL,LEAD-FREE HASL,Immersion gold,Immersion tin,Immersion Silver,Plated gold,OSP,Carbon ink.
|
|
Solder Mask Color
|
Green,Red,White,Yellow,Black,Blue
|
|
Quality Standards
|
IPC-A-600F and MIL-STD-105D CHINA GB4588
|