1. Application
The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the EMC, electronic packaging, Electronic adhesive, Copper Clad Laminate, Underfiller, daily chemical products and so on.
2. Main Specifications
SiO2 Purity: 99.95% min.
Size: D50, 0.5-10um per the user’s demands.
3. Type and Typical Data
|
ITEM
|
UNIT
|
SSP - 10
|
SSP- 7
|
SSP- 4
|
SSP – 2.5
|
SSP- 1
|
|
Size: D50
|
µm
|
10±2
|
7.0±1
|
4.0±1
|
2.5±0.5
|
1.0±0.5
|
|
Size: Dmax
|
45
|
30
|
15
|
10
|
5
|
|
|
SiO2 content
|
%
|
99.95
|
99.95
|
99.95
|
99.95
|
99.95
|
|
H2O content
|
0.05
|
0.05
|
0.05
|
0.05
|
0.05
|
|
|
percent of spheroidization
|
>98
|
>98
|
>98
|
>98
|
>98
|
|
|
Specific surface area
|
M2g-1
|
1.0
|
1.5
|
1.7
|
1.9
|
9.0
|
|
Na
|
ppm
|
<10
|
<10
|
<10
|
<10
|
<10
|
|
K
|
<2
|
<2
|
<2
|
<2
|
<2
|
|
|
Ca
|
<3
|
<3
|
<3
|
<3
|
<3
|
|
|
Mg
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
Al
|
<50
|
<50
|
<50
|
<50
|
<50
|
|
|
Fe
|
<10
|
<10
|
<10
|
<10
|
<10
|
|
|
Ti
|
<10
|
<10
|
<10
|
<10
|
<10
|
|
|
As
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
P
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
Cr
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
Mn
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
Ni
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
Cu
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
Mo
|
<1
|
<1
|
<1
|
<1
|
<1
|
|
|
U
|
ppb
|
<0.3
|
<0.3
|
<0.3
|
<0.3
|
<0.3
|
pengl $ sinosi, org