Features:
1. using imported synthetic stone materials, high-quality imported bakelite, glass

   fiber, alloy materials.
2. wave soldering and reflow soldering of printed circuit board tooling.
3. tin stove to reduce the substrate due to excessive deformation and static

   electricity caused by the breakdown.
4. applied with the same size shape of the substrate.
5. which can move through a set number of PCB production line, saving manpower and

   time after welding to improve productivity.