•Material: PI
•Copper thickness: Copper E-Cu F20, plated with tin, 100µm thickness
•Layer: 1 layers
•Coverlayer: PI+ MBC black
•Adhesive film:3M Y582 of 150 µm thickness + 80 µm liner
•Solder depot: Sn62Pb36Ag2
•flux depot: EA0515 Xersin Multicore
•Applicat: Mazda J68 Flat Cable