High stability
The semiconductor pump laser marking system uses semiconductor technology to replace traditional electro vacuum technology and the excitation source uses high power semiconductor matrix, extending the service life of the product and system stability significantly.
Suitable materials include: common metal and alloy (all metals include iron, copper, aluminum, magnesium and zinc), rare metal and alloy (gold, nickel, and titanium), metal oxide, special surface process (phosphating, aluminum anodizing and electroplated surface), ABS material (electric apparatus shell, daily necessities), ink (light-transmitting keys, printing products), epoxy resin (packages and insulating layer of electronic components).
Technical parameters
Model
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XHY-DP50
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XHY-DP75
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Laser output power
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≤50W
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≤75W
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Laser wavelength
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1064nm
|
|
Light beam mass m2
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<6
|
|
Laser repeating frequency
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≤50KHz
|
|
Standard carving range
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100mm×100mm
|
|
Optional carving range
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70mm×70mm/100mm×100mm/150mm×150mm (optional)
|
|
Carving depth
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≤0.50mm
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≤1mm
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Integrity power
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1.5KW
|
2.0KW
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Minimum line width
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0.015mm
|
|
Repeating precision
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±0.0025mm
|
|
Carving line speed
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≤7000mm/s
|
|
Cooling system
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High precision constant temperature ±0.1/circulating chiller
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