Product Main

Specifications

High stability
The semiconductor pump laser marking system uses semiconductor technology to replace traditional electro vacuum technology and the excitation source uses high power semiconductor matrix, extending the service life of the product and system stability significantly.

Suitable materials include: common metal and alloy (all metals include iron, copper, aluminum, magnesium and zinc), rare metal and alloy (gold, nickel, and titanium), metal oxide, special surface process (phosphating, aluminum anodizing and electroplated surface), ABS material (electric apparatus shell, daily necessities), ink (light-transmitting keys, printing products), epoxy resin (packages and insulating layer of electronic components).
 
Technical parameters

 

Model
XHY-DP50
XHY-DP75
Laser output power
≤50W
≤75W
Laser wavelength
1064nm
Light beam mass m2
<6
Laser repeating frequency
≤50KHz
Standard carving range
100mm×100mm
Optional carving range
70mm×70mm/100mm×100mm/150mm×150mm (optional)
Carving depth
≤0.50mm
≤1mm
Integrity power
1.5KW
2.0KW
Minimum line width
0.015mm
Repeating precision
±0.0025mm
Carving line speed
≤7000mm/s
Cooling system
High precision constant temperature ±0.1/circulating chiller