BCU resin-copper bond polishing pads, style DR. With high diamond concentration and copper inside, the BCE serial pads, never use Sic as additive, with aggressive and tenaciously, better heat transmissibility performance, can be used both by dry or by wet. They are designed for a variety of applications and can be used in the fabrication shop and at the jobsite. They are with the capability for a high glossy degree. Standard BCU pads see below. Other styles and sizes are available on customer's request