Pcb Solder Pallet Materials are glass fibre composite specifically designed to meet the various challenges of the PCB assembly process. It is suitable to wave soldering and SMT process.
- It can be machined to the tolerances required for accurate and retains its flatness through continued cycling in reflow oven. -- The low thermal conductivity of the materials prevents heat sinking from PCB, ensuring adequate reflow of the solder paste.
Application:
- It can be used in following applications in SMT aseembly process.
- Solder paste printing
- SMT placement
- Reflow
-- Wave soldering process